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Types of Cpu Radiators
2024-06-17 17:29:57
Pure aluminum radiator
Pure aluminum radiator is the most common radiator in the early days, its manufacturing process is simple, low cost, pure aluminum radiator still occupies a considerable part of the market. In order to increase the heat dissipation area of its fins, the most commonly used processing means for pure aluminum radiator is aluminum extrusion technology, and the main indexes for evaluating a pure aluminum radiator are the thickness of the radiator's base and the Pin-Fin ratio, which refers to the height of a radiator's fins, and Fin refers to the distance between two adjacent fins, and the Pin-Fin ratio is the height of Pin (excluding the thickness of the base) divided by Fin, which means that a radiator is more effective. The larger the Pin-Fin ratio means the larger the effective heat dissipation area of the radiator, representing the more advanced aluminum extrusion technology.
Ceramic radiator (also known as ceramic heat exchanger)
The production process is basically the same as that of kiln furniture. Thermal conductivity and oxidation resistance are the main application properties of the material. It is the principle of the ceramic radiator is placed closer to the flue outlet, higher temperature places, do not need to be mixed with cold air and high-temperature protection, when the kiln temperature of 1250-1450 ° C, the flue outlet temperature should be 1000-1300 ° C, the ceramic heat exchanger recovery of residual heat up to 450-750 ° C, will be recovered to the hot air sent into the kiln and the gas gas to form a mixture of gas combustion, which Can reduce production costs and increase economic benefits. Ceramic heat exchanger in the use of metal heat exchanger under the limitations of the development of a good, because it is a better solution to the corrosion resistance, high temperature and other issues, to become the recovery of high-temperature waste heat recovery of the best heat exchanger. After years of production practice, the results show that the ceramic heat exchanger is very effective. Its main advantages are: good thermal conductivity, high temperature strength, oxidation resistance, good thermal shock resistance, long life, small maintenance, reliable and stable performance, easy to operate. It is the best device for recovering high temperature flue gas waste heat.
Pure copper radiator
The heat transfer coefficient of copper is 1.69 times higher than that of aluminum, so under the premise of other conditions being the same, the pure copper radiator can take the heat away from the heat source more quickly. However, the texture of the copper is an issue, and many radiators labeled as “pure copper” are not really 100% copper. On the copper list, copper containing more than 99% copper is known as acid-free copper, and the next grade of copper is danish copper, which contains less than 85% copper. Most pure copper radiators on the market for 13 years have a copper content somewhere in between. The copper content of some poor quality pure copper radiator is even less than 85%, although the cost is very low, but its thermal conductivity is greatly reduced, affecting the heat dissipation. In addition, copper also has obvious shortcomings, high cost, processing is difficult, radiator quality is too large to hinder the application of all-copper heat sink; red copper hardness is not as good as the aluminum alloy AL6063, some mechanical processing (such as dissecting grooves, etc.) performance is not as good as the aluminum; the melting point of the copper is much higher than the aluminum, is not conducive to extrusion molding ( Extrusion ) and other issues.
Copper-aluminum bonding technology
Copper-aluminum bonding
After considering the respective disadvantages of copper and aluminum, some high-end radiators in the market tend to adopt the copper-aluminum combination manufacturing process, and these heat sinks usually use copper metal base, while the cooling fins use aluminum alloy. Of course, in addition to the copper base, there are also heat sinks using copper columns and other methods, is the same principle. With high thermal conductivity, the copper base can quickly absorb the heat released by the CPU; aluminum fins can be made into the most conducive to heat dissipation with the help of complex technology means, and provide a larger space for heat storage and rapid release, which in all aspects of a balanced point found.