Computer CPU COOLER

Computer Cpu Cooler Product Introduction

Integrated circuits are widely used in computer components. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only cause unstable system operation and shorten service life, but may even burn some components. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or from inside the integrated circuit. The function of the radiator is to absorb this heat and then dissipate it into or outside the chassis to ensure the normal temperature of computer components. Most radiators absorb heat by contacting the surface of the heating components, and then transfer the heat to a distant place through various methods, such as the air in the chassis, and then the chassis transfers the hot air to the outside of the chassis to complete the heat dissipation of the computer. There are many types of radiators. CPU, graphics card, motherboard chipset, hard disk, chassis, power supply and even optical drive and memory all need radiators. These different radiators cannot be mixed, and the most commonly used one is the CPU radiator. According to the way of taking away heat from the radiator, the computer radiator can be divided into active cooling and passive cooling. The former is commonly air-cooled radiator, while the latter is commonly heat sink. Further subdividing the heat dissipation methods, it can be divided into air cooling, heat pipe, liquid cooling, semiconductor cooling, compressor cooling, etc.

Heat sink material

The heat sink material refers to the specific material used for the heat sink. Each material has different thermal conductivity. They are arranged from high to low in terms of thermal conductivity, namely silver, copper, aluminum, and steel. However, it would be too expensive to use silver as a heat sink, so the best solution is to use copper. Although aluminum is much cheaper, its thermal conductivity is obviously not as good as copper (only about 50% of copper). Commonly used heat sink materials are copper and aluminum alloy, each of which has its own advantages and disadvantages. Copper has good thermal conductivity, but it is expensive, difficult to process, too heavy (many pure copper heat sinks exceed the weight limit of the CPU), small heat capacity, and easy to oxidize. Pure aluminum is too soft and cannot be used directly. Aluminum alloy is used to provide sufficient hardness. The advantages of aluminum alloy are low price and light weight, but its thermal conductivity is much worse than copper. Some heat sinks take their strengths and embed a copper plate on the base of the aluminum alloy heat sink. For ordinary users, an aluminum heat sink is sufficient to meet heat dissipation needs.